Property | Value |
Synonyms | Bis-AP-AF; 6FAP; 4,4'-(Hexafluoroisopropylidene)bis(2-aminophenol) |
Molecular Formula | C₁₅H₁₂F₆N₂O₂ |
Molecular Weight | 366.26 g/mol |
Appearance | White to off-white crystalline powder or solid |
Melting Point | 243–248 °C (lit.) |
Boiling Point | 411 °C (predicted) |
Density | 1.5 g/cm³ (predicted) |
Description of 2,2-Bis(3-amino-4-hydroxyphenyl)hexafluoropropane
2,2-Bis(3-amino-4-hydroxyphenyl)hexafluoropropane (CAS: 83558-87-6), also known as Bis-AP-AF or 6FAP, is a fluorinated aromatic diamine monomer. This specialty monomer is widely used in the synthesis of high-performance fluorinated polyimides and polybenzoxazoles (PBO). The incorporation of hexafluoroisopropylidene (-C(CF₃)₂-) and hydroxy groups imparts excellent thermal stability, low dielectric constant, low moisture absorption, and superior optical transparency.
Application of 2,2-Bis(3-amino-4-hydroxyphenyl)hexafluoropropane
Fluorinated Polyimide Monomer. Key diamine for synthesizing soluble, low-dielectric-constant polyimides with excellent thermal stability (Tg >300°C) and low moisture absorption.
Polybenzoxazole (PBO) Precursor. Used to prepare high-performance polybenzoxazoles exhibiting superior heat resistance, mechanical strength, and chemical stability for advanced composites.
Flexible Displays and Electronics. Enables transparent, low-CTE polyimide films for flexible OLED/AMOLED substrates, cover windows, and foldable device applications.
Optical Waveguides and Photonics. Produces low-loss, high-transparency fluorinated polymers ideal for optical waveguides, lenses, and photonic integrated circuits.
Microelectronics and Semiconductor Insulation. Applied in passivation layers, buffer coatings, and interlayer dielectrics requiring low-k, high thermal stability, and excellent adhesion.
Storage of 2,2-Bis(3-amino-4-hydroxyphenyl)hexafluoropropane
It should be kept in a tightly sealed original container in a cool, dry, well-ventilated area away from direct sunlight, heat, and moisture. Keep away from strong oxidizing agents, acids, bases, and incompatible materials to prevent degradation or reactions. Avoid prolonged exposure to air to minimize oxidation.
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