Property | Value |
Chemical Name | 4,4'-Methylenebis(N,N-diglycidylaniline) (also known as Tetraglycidyl-4,4'-methylenedianiline or TGDDM) |
CAS Number | 28768-32-3 |
Molecular Formula | C₂₅H₃₀N₂O₄ |
Molecular Weight | 422.52 g/mol |
Appearance | Yellow to reddish-brown viscous liquid |
Density (at 25°C) | 1.15 g/mL |
Boiling Point | 619.3 ± 35.0 °C (predicted) |
Flash Point | >230°F |
Refractive Index (n²⁰/D) | 1.601 |
Viscosity (at 50°C) | 3000–6000 cPs (typical) |
Epoxy Equivalent Weight | 106–120 g/eq |
Epoxy Value | 0.83–0.94 mol/100g |
Solubility in Water | 9.2 mg/L at 20°C |
Vapor Pressure (at 24.85°C) | 0 Pa |
Description of 4,4'-Methylenebis(N,N-diglycidylaniline)
TGDDM (CAS: 28768-32-3) is a tetrafunctional aromatic epoxy resin monomer with the molecular formula C₂₅H₃₀N₂O₄. This yellow to reddish-brown viscous liquid is widely used as a high-performance curing agent and crosslinker in advanced composite materials and adhesives. When cured with hardeners such as aromatic amines or anhydrides, TGDDM forms highly crosslinked networks exhibiting exceptional thermal stability (Tg > 250°C), superior mechanical strength, excellent chemical resistance, and low moisture absorption. It is a key component in aerospace composites, high-temperature laminates, structural adhesives, and electronic encapsulants, delivering outstanding performance under extreme conditions.
Application of 4,4'-Methylenebis(N,N-diglycidylaniline)
High-Temperature Aerospace Composites. TGDDM is a key resin monomer in advanced carbon-fiber-reinforced composites for aerospace applications. When cured with aromatic amines, it delivers exceptional thermal stability (Tg > 250°C), high mechanical strength, and low moisture absorption, making it ideal for structural components like aircraft engine parts, wings, and fuselage sections.
Electronic and Electrical Encapsulants. This tetrafunctional epoxy resin is widely used in high-reliability electronic packaging and encapsulation. Its superior heat resistance, electrical insulation, and dimensional stability suit it for encapsulating semiconductors, power modules, and high-voltage components in demanding environments.
Structural Adhesives and Bonding Agents. TGDDM-based adhesives provide excellent bond strength, high-temperature performance, and chemical resistance. They are used in bonding metal-to-metal or composite structures in aerospace, automotive, and industrial applications requiring durability under extreme conditions.
High-Performance Laminates and Prepregs. TGDDM is formulated into prepregs for multilayer printed circuit boards (PCBs) and high-temperature laminates. It ensures outstanding thermal and mechanical properties for use in military, avionics, and telecommunications equipment.
Specialty Coatings and Composites. TGDDM enables the production of coatings and composites with ultra-high heat resistance and low outgassing, suitable for nuclear industry components, space applications, and other extreme environments.
Storage of 4,4'-Methylenebis(N,N-diglycidylaniline)
It should be kept in a cool, dry, well-ventilated area at temperatures between 5–25°C. Keep containers tightly sealed to prevent moisture absorption and contamination. Avoid exposure to direct sunlight, heat sources, and strong oxidizing agents. Protect from freezing. Handle with care to minimize skin and eye contact. For long-term storage, nitrogen blanketing may be recommended to reduce potential oxidation or reaction with air.
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