Phosphine oxide, 1,1'-[1,4-phenylenebis(methylene)]bis[1,1-diphenyl- NEW

Flame retardant XDPO is a novel halogen-free flame retardant with a structure similar to DOPO derivatives, featuring a melting point of 334°C and a decomposition temperature of 379°C (5%). It exhibits superior performance and is applied in electronic materials and spinning fields, characterized by high-temperature resistance, high melting point, and high Tg. It is suitable for high-end copper-clad laminates (CCL), FCCL, FR4, etc., offering efficient flame retardancy, low dielectric constant, low expansion coefficient, and high dielectric strength.  This flame retardant is a downstream derivative of diphenylphosphinic chloride and serves as an additive-type flame retardant. As a phosphorus-based flame retardant without reactive functional groups, it provides better dielectric properties. With its high melting point, when combined with vinyl compounds, it yields resin compositions that produce composites with low thermal expansion, high heat resistance, high glass transition temperature (Tg), and low dielectric constant and loss.  It can be used to manufacture multilayer boards and circuit boards with high Tg, low dielectric properties, halogen-free flame retardancy, and low substrate thermal expansion coefficient, as well as polymer flame retardants. It is also applicable in materials such as FCCL and CCL for 5G applications. Particle size can be customized according to customer requirements.